Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Journal article published in 2018 by
Junghwan Bang,
Dong-Yurl Yu,
Ming Yang,
Yong-Ho Ko,
Jeong-Won Yoon,
Hiroshi Nishikawa,
Chang-Woo Lee
This paper is made freely available by the publisher.
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