Published in
AIP Publishing, Applied Physics Letters, 4(113), p. 041902
DOI: 10.1063/1.5039923
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Thermal percolation in composite materials with electrically conductive fillers
Journal article published in 2018 by
Bo Shi,
Lan Dong,
Mingqiang Li,
Bin Liu,
Kyunghoon Kim,
Xiangfan Xu 
,
Jun Zhou ,
Jun Liu
,
Jun Zhou ,
Jun Liu
This paper was not found in any repository, but could be made available legally by the author.
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