Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 3(6), p. 359-365
DOI: 10.1109/tcpmt.2016.2519522
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A -Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production
Journal article published in 2016 by
Bing Zhang,
Camilla Karnfelt,
Heiko Gulan,
Thomas Zwick,
Herbert Zirath
This paper was not found in any repository, but could be made available legally by the author.
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